GlobalFoundries’ $2 billion agreement with Taiwan Semiconductor Manufacturing Co. expands a US chip-packaging capability that GlobalFoundries already possessed nearly two years ago. The new commercial step is supplying TSMC’s advanced-packaging system, rather than introducing silicon-interposer manufacturing to New York for the first time.
In October 2024, GlobalFoundries executive Greg Kleese told semiconductor publication 3D InCites that the company’s 65PKG interposer process was production-qualified and manufactured at its Malta facility. He said the service was available to customers using chips fabricated by other foundries.
Now, GlobalFoundries said on Thursday that its agreement with TSMC would establish the first US-based source of interposers supporting advanced-packaging technologies, including embedded deep-trench capacitor components.
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Under the agreement, GlobalFoundries will add fabrication capacity at Malta and manufacture interposers for TSMC’s Chip-on-Wafer-on-Substrate platform.
These components provide electrical connections between processors and high-bandwidth memory inside advanced computing packages. The companies are said not to be transferring the processor manufacturing to the New York facility.
The agreement has an initial five-year term. GlobalFoundries expects volume production to begin ramping in the first half of 2028, meaning the project does not immediately increase available interposer supply.
The 2024 interview also identified deep-trench capacitors among technologies GlobalFoundries was investigating for its interposer roadmap. Thursday’s announcement names embedded deep-trench capacitor components among the technologies the expanded supply would support.
However, the company did not identify the manufacturing process involved or confirm whether its existing 65PKG technology meets TSMC’s requirements.
GlobalFoundries described the arrangement as a multiyear $2 billion agreement but provided no breakdown of its financial terms. The announcement also does not specify guaranteed purchase commitments, expected annual revenue, production volumes, or capital expenditures required for the expansion.
The companies also have an established commercial relationship. In November 2025, GlobalFoundries announced a licensing agreement for TSMC’s gallium nitride technology, targeting power applications for data centers, industrial equipment, and automotive systems.
Reuters reported that GlobalFoundries shares rose approximately 4% in premarket trading following Thursday’s announcement.
